international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.
검색 하기 키워드:
wafer bumping, wafer bumping contract services, wafer level processing, wafer level packaging contract services, wlp, wafer electroplating, high aspect ratio electroplating, electroplating, ubm, thick photoresist, gold bump, gold bumping, au bumping, solder bumps, solder bumping, tin lead bumps, pillar bumps, copper pillar bumps, copper electroplating, indium bumps, indium bumping, gold/tin bumps, au/sn bumps, au/sn bumping, known good packaging, known good die, advanced chip packaging, tape automated bonding, tab, flipchip, flip chip packaging, bare die packaging, fine pitch bumps, plated vias, plated bumps, bump, bumps, plating, imi, international micro industries, inc., cherry hill, new jersey, nj
회사 주소 :
1951 Old Cuthbert Road - Building 404,HADDONFIELD,NJ,USA